Remove footprint description

fab.pretty/SOIC-8_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod

-(module SOIC-8_3.9x4.9mm_P1.27mm_EP2.41x3.3mm (layer F.Cu) (tedit 5EB86736)
-  (descr "8-Lead Thermally Enhanced Plastic Small Outline (SE) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
+(module SOIC-8_3.9x4.9mm_P1.27mm_EP2.41x3.3mm (layer F.Cu) (tedit 5F06CCC6)
   (tags "SOIC 1.27")
   (attr smd)
   (fp_text reference REF** (at 0 -3.5) (layer F.SilkS)
@@ -8,12 +7,12 @@
   (fp_text value SOIC-8_3.9x4.9mm_P1.27mm_EP2.41x3.3mm (at 0 0) (layer F.Fab)
     (effects (font (size 1 1) (thickness 0.15)))
   )
-  (fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
+  (fp_circle (center -2.87 -3.23) (end -2.67 -3.23) (layer F.SilkS) (width 0.12))
   (fp_line (start -3.69 -2.575) (end 2.075 -2.575) (layer F.SilkS) (width 0.15))
+  (fp_line (start -2.075 2.575) (end 2.075 2.575) (layer F.SilkS) (width 0.15))
   (fp_text user %R (at 0 0) (layer F.Fab)
     (effects (font (size 0.9 0.9) (thickness 0.135)))
   )
-  (fp_circle (center -2.87 -3.23) (end -2.67 -3.23) (layer F.SilkS) (width 0.12))
   (pad 9 smd rect (at 0 0) (size 2.41 3.3) (layers F.Cu F.Paste F.Mask)
     (solder_paste_margin_ratio -0.2))
   (pad 8 smd rect (at 2.8 -1.905) (size 1.8 0.7) (layers F.Cu F.Paste F.Mask))