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Commit 8df78f1d authored by Krisjanis Rijnieks's avatar Krisjanis Rijnieks :lion_face:
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Improve FFC connector footprint

parent 0cf032f5
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Pipeline #482328 passed
Stage: test
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    fab.pretty/Conn_FFC_1x04_P1mm_SideEntry_GCT_FFC3B11-04-T.kicad_mod
    + 6
    − 6
    View file @ 8df78f1d
    ......@@ -101,16 +101,16 @@
    (stroke (width 0.1) (type default)) (layer "F.Fab") (tstamp 0f9dad73-074b-4658-bbcf-421e85ef0ab9))
    (fp_line (start 5.5 4.2) (end 5.5 3.4)
    (stroke (width 0.1) (type default)) (layer "F.Fab") (tstamp 9d800e69-322f-447b-986b-68842015d1ca))
    (pad "" smd rect (at -4.25 0) (size 2.5 2.8) (drill (offset 0 1.4)) (layers "F.Cu" "F.Paste" "F.Mask")
    (pad "" smd rect (at -4.25 1.4) (size 2.5 2.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (thermal_bridge_angle 45) (tstamp 57d68203-86b5-4166-b592-ff8945a4ee86))
    (pad "" smd rect (at 4.25 0) (size 2.5 2.8) (drill (offset 0 1.4)) (layers "F.Cu" "F.Paste" "F.Mask")
    (pad "" smd rect (at 4.25 1.4) (size 2.5 2.8) (layers "F.Cu" "F.Paste" "F.Mask")
    (thermal_bridge_angle 45) (tstamp a48661be-8729-4983-8ccc-4cbd60b04f70))
    (pad "1" smd rect (at -1.5 -0.2) (size 0.6 1.7) (drill (offset 0 -0.85)) (layers "F.Cu" "F.Paste" "F.Mask")
    (pad "1" smd rect (at -1.5 -1.05) (size 0.6 1.7) (layers "F.Cu" "F.Paste" "F.Mask")
    (thermal_bridge_angle 45) (tstamp 114f26b1-6d5b-46ba-a99f-9dc94212d586))
    (pad "2" smd rect (at -0.5 -0.2) (size 0.6 1.7) (drill (offset 0 -0.85)) (layers "F.Cu" "F.Paste" "F.Mask")
    (pad "2" smd rect (at -0.5 -1.05) (size 0.6 1.7) (layers "F.Cu" "F.Paste" "F.Mask")
    (thermal_bridge_angle 45) (tstamp 9dbf618b-3fe4-474e-b09e-0e4ff8989a3a))
    (pad "3" smd rect (at 0.5 -0.2) (size 0.6 1.7) (drill (offset 0 -0.85)) (layers "F.Cu" "F.Paste" "F.Mask")
    (pad "3" smd rect (at 0.5 -1.05) (size 0.6 1.7) (layers "F.Cu" "F.Paste" "F.Mask")
    (thermal_bridge_angle 45) (tstamp 103f5108-8fa7-4028-913a-276b3784720e))
    (pad "4" smd rect (at 1.5 -0.2) (size 0.6 1.7) (drill (offset 0 -0.85)) (layers "F.Cu" "F.Paste" "F.Mask")
    (pad "4" smd rect (at 1.5 -1.05) (size 0.6 1.7) (layers "F.Cu" "F.Paste" "F.Mask")
    (thermal_bridge_angle 45) (tstamp 7f57ac1c-33bf-49a0-86ca-478155a9fdbe))
    )
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