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Commit 758f5030 authored by Krisjanis Rijnieks's avatar Krisjanis Rijnieks :lion_face:
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Add stepper driver pad as pin 25

parent 626b385a
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......@@ -2680,7 +2680,7 @@ ENDDEF
#
DEF STEPPER_DRIVER_A4982 U 0 40 Y Y 1 F N
F0 "U" -450 700 50 H V L CNN
F1 "STEPPER_DRIVER_A4982" -450 -700 50 H V L CNN
F1 "STEPPER_DRIVER_A4982" -200 700 50 H V L CNN
F2 "fab:24-TSSOP-EP" 0 0 50 H I C CNN
F3 "" 0 0 50 H I C CNN
$FPLIST
......@@ -2705,6 +2705,7 @@ X VBB2 21 550 250 100 L 50 50 1 1 W
X OUT2B 22 550 350 100 L 50 50 1 1 O
X ~ENABLE 23 550 450 100 L 50 50 1 1 I
X GND 24 550 550 100 L 50 50 1 1 W
X PAD 25 0 -750 100 U 50 50 1 1 I
X VCP 3 -550 350 100 R 50 50 1 1 B
X VREG 4 -550 250 100 R 50 50 1 1 I
X MS1 5 -550 150 100 R 50 50 1 1 I
......
(module 24-TSSOP-EP (layer F.Cu) (tedit 5EC23A76)
(module 24-TSSOP-EP (layer F.Cu) (tedit 5EC263FA)
(descr "TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot355-1_po.pdf)")
(tags "SSOP 0.65")
(attr smd)
......@@ -49,7 +49,7 @@
(pad 3 smd rect (at -2.85 -2.275) (size 1.65 0.34) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.85 -2.925) (size 1.65 0.34) (layers F.Cu F.Paste F.Mask))
(pad 1 smd rect (at -2.85 -3.575) (size 1.65 0.34) (layers F.Cu F.Paste F.Mask))
(pad 24 smd rect (at 0 0) (size 3 4.32) (layers F.Cu F.Paste F.Mask))
(pad 25 smd rect (at 0 0) (size 3 4.32) (layers F.Cu F.Paste F.Mask))
(model ${KISYS3DMOD}/Housings_SSOP.3dshapes/TSSOP-24_4.4x7.8mm_Pitch0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
......
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