@@ -126,9 +126,15 @@ But this time I used [Mods](http://mods.cba.mit.edu/) instead of Fabmodules. Her
I started to mill the board, solder the components by following the workflow described in [Electronics Production week](./Electronics Production.md).
On the first attempt, the I found that the edges of outline were too close to the traces, and they were fragile.
After offsetting the outline farther away, and milling the board again, the board with componants looks like this:
After offsetting the outline farther away, and milling the board again, I found that the pin headers were floating outside instead of resting on the board:
So chaning the outline accordingly, this is how the pins should rest:
And after soldering all components, here is how the final board looks:
Programming the board is done during the [Embedded Programming](./Embedded Programming.md) week.
